Printing speeds up to 100mm/sec
Higher viscosity for better print definition
Excellent wetting compatibility on most board finishes
ULTRA-LOW Voiding for CSP, LGA & BGA Assemblies
RoHS 3 and REACH compliant
Flux Type: No Clean
Flux Classification: ROL0
Metal Content: 89.75% metal by weight.
Particle Size: T5 (15-25 microns)
Melting Point: 137C (279F)
Size: 500g jar
Refrigerated >12 months, unrefrigerated >1 month
>8 hours @ 20-50% RH 22-28C (72-82F)
>6 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.