HMT Solder
  Top » Catalog » Solder Paste » HMT19Ge-T4-100S  

Cleaning Chemicals
Liquid Flux
Nano Coating
Removal Alloy
Solder Bar
Solder Paste
  NC (HMT29/HMT11)
  NC (HMT55)
  NC HF (HMT19)
  RMA (HMT59)
  WW H1 (HMT43HA)
  WW L0 (HMT43L0)
  WW M0 (HMT43)
Solder Spheres
Solder Wire Flux Cored
Solder Wire Solid
Super Solvent NFIPA
Tacky Flux
Shipping & Returns
Privacy Notice
Conditions of Use
Contact Us

19 Series Solder Paste No-Clean Halogen-Free Sn/Cu0.7/Ni0.05/Ge0.006 T4 100g Syr

[Part Number: HMT19Ge-T4-100S]
Click to enlarge

Uniform grain structure alloy with antioxidant properties
Clear residue
Long Stencil Life
ULTRA-LOW Voiding for CSP, LGA & BGA Assemblies
Excellent wetting compatibility on most board finishes
RoHS 3 and REACH compliant
Halogen Free

Alloy: Sn/Cu0.7/Ni0.05/Ge0.006
Flux Type: No Clean
Flux Classification: ROL0
Metal Content: 86% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 227C (441F)
Size: 100g syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >1 month

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

HMT19Ge is a no-clean solder paste that can be left on the board for most SMT assemblies. For applications requiring cleaning, HMT19Ge can be removed with HMT175CS Co-Solvent series flux cleaner, or most commercially available aqueous cleaners.

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.


MSDS Sheet
Related Products
19 Series Tacky Flux No-Clean Halogen-Free 10g Syringe
19 Series Tacky Flux No-Clean Halogen-Free 10g Syringe

Copyright © 2020-2023 HMT Solder