Uniform grain structure alloy with antioxidant properties
Long Stencil Life
ULTRA-LOW Voiding for CSP, LGA & BGA Assemblies
Excellent wetting compatibility on most board finishes
RoHS 3 and REACH compliant
Flux Type: No Clean
Flux Classification: ROL0
Metal Content: 86% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 227C (441F)
Size: 100g syringe
Refrigerated >12 months, unrefrigerated >1 month
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
HMT19Ge is a no-clean solder paste that can be left on the board for most SMT assemblies. For applications requiring cleaning, HMT19Ge can be removed with HMT175CS Co-Solvent series flux cleaner, or most commercially available aqueous cleaners.
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.