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19 Series Solder Paste No-Clean Halogen-Free Sn96.5/Ag3.0/Cu0.5 T4 500g Jar

[Part Number: HMT19SAC-T4-500J]
200
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Description
Printing speeds up to 100mm/sec
Higher viscosity for better print definition
Clear residue
Excellent wetting compatibility on most board finishes
ULTRA-LOW Voiding for CSP, LGA & BGA Assemblies
Halogen Free
RoHS 3 and REACH compliant

Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: No Clean
Flux Classification: ROL0
Metal Content: 88.5% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 217-220C (423-428F)
Size: 500g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >1 month

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>6 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Cleaning
HMT19SAC is a no-clean solder paste that can be left on the board for most SMT assemblies. For applications requiring cleaning, HMT19SAC can be removed with HMT-175CS Co-Solvent series flux cleaner, or most commercially available aqueous cleaners.

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
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