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19 Series Solder Paste No-Clean Halogen-Free Sn63/Pb37 T4 500g Jar

[Part Number: HMT19PB-T4-500J]
Click to enlarge

Clear residue
Long Stencil Life
Ultra-Low Voiding for LGA, BGA & CSP Components
Halogen Free
Excellent wetting compatibility on most board finishes
RoHS 3 and REACH Compliant

Alloy: Sn63/Pb37
Flux Type: No Clean
Flux Classification: ROL0
Metal Content: 90% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 500g jar

Shelf Life
Refrigerated >12 months, unrefrigerated >1 month

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>6 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

HMT19PB is a no-clean solder paste that can be left on the board for most SMT assemblies. For applications requiring cleaning, HMT19PB can be removed with HMT175CS Co-Solvent series flux cleaner.

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to:


MSDS Sheet
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