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11 Series Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 T5 100g Syringe

[Part Number: HMT11LT-T5-100S]
200
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Description
Printing speeds up to 100mm/sec
Long stencil life, Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
RoHS 3 and REACH compliant

Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: No Clean
Flux Classification: REL0
Metal Content: 87% metal by weight.
Particle Size: T5 (15-25 microns)
Melting Point: 137C (279F)
Size: 100g syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >1 month

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>6 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

Documents

Datasheet
MSDS Sheet
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11 Series Tacky Flux No-Clean for Low Temp 10g Syringe
11 Series Tacky Flux No-Clean for Low Temp 10g Syringe

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