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29 Series Solder Paste No-Clean Sn63/Pb37 T4 600g Cartridge

[Part Number: HMT29PB-T4-600C]
200
Click to enlarge

Description
Printing speeds up to 100mm/sec
Long stencil life, Wide process window
Clear residue
Low Voiding
Excellent wetting compatibility on most board finishes
Compatible with enclosed print heads
Passes BONO corrosion test

Specifications
Alloy: Sn63/Pb37
Flux Type: No Clean
Flux Classification: ROL0
Metal Content: 90% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 600g cartridge

Shelf Life
Refrigerated >12 months, unrefrigerated >1 month

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>6 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov

Documents

Datasheet
MSDS Sheet
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