Description
Excellent Print Definition
Long Stencil Life
Compatible with enclosed print heads
Excellent wetting compatibility on most board finishes
RoHS 3 and REACH Compliant
Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: RMA
Flux Classification: ROM1
Metal Content: 86% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 217-221C (423-428F)
Size: 100g syringe
Shelf Life
Refrigerated >6 months, unrefrigerated >1 month
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>6 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Cleaning
HMT59SAC is a Rosin Mildly Activated solder paste that can be left on the board for most SMT assemblies. For applications requiring cleaning, HMT59SAC can be removed with HMT-175CS Co-Solvent series flux cleaner, or most commercially available aqueous cleaners.
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Documents
Datasheet MSDS Sheet
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